*rohs directive 2002/95/ec jan 27 2003 including annex. specifications are subject to change without notice. customers should verify device performance in their specific applications. mx3a-12sa(-p) smt non-isolated power module features industry standard smt package output voltage programmable from 0.75 vdc to 5.5 vdc via external resistor 3 a output current up to 95 % efficiency small size, low profile cost-efficient low output ripple and noise high reliability remote on/off output overcurrent protection (non-latching) description bourns ? mx3a-12sa(-p) is a non-isolated dc-dc converter offering designers a cost and space-efficient solution with standard features such as remote on/off, precisely regulated programmable output voltage and overcurrent protection. parameter min. nom. max. units notes input voltage 8.3 12 14 v dc 18 v max. for -w version current 2.0 a dc remote on/off: standar d -p option low or open = on off 0.4 v dc 10 a max. high = off on 2.4 v in v dc 1 ma max. output voltage adjustment range 0.75 5.5 v dc current 0.0 3.0 a dc voltage setpoint accuracy -2.5 2.5 % v o,set line regulation 0.3 % v o,set load regulation 0.4 % v o,set temperature regulation 0.4 % v o,set 0 to +85 c ripple (pk-pk) (20 mhz bandwidth) 30 50 mvpk-pk 1 f ceramic//10 f tantalum capacitors ripple (rms) 10 15 mvrms 1 f ceramic//10 f tantalum capacitors dynamic load response: 50 % to 100 % load or 100 % to 50 % load; 200 mv 1 f ceramic//10 f tantalum capacitors ( ? i/ ? t = 2.5 a/ s; 25 c) 25 s 50 % to 100 % load or 100 % to 50 % load; 75 mv 2 x 100 f polymer capacitors ( ? i/ ? t = 2.5 a/ s; 25 c) 100 s general mtbf 13,000 khrs operating temperature -40 +85 c storage temperature -55 +125 c switching frequency 300 khz efficiency 86.0 % v o,set = 1.2 v dc (vin = 12 vdc, t a = 25 c, full load) 88.0 % v o,set = 1.5 v dc 90.0 % v o,set = 1.8 v dc 91.0 % v o,set = 2.5 v dc 93.0 % v o,set = 3.3 v dc 95.0 % v o,set = 5.0 v dc specifications intermediate bus architecture distributed power applications workstations and servers telecom equipment enterprise networks including lans/wans latest generation ics (dsp, fpga, asic) and microprocessor powered applications applications *rohs compliant
specifications are subject to change without notice. customers should verify device performance in their specific applications. mx3a-12sa(-p) smt non-isolated power module product dimensions derating output current vs. local ambient temp & airflow recommended pad layout rev. a 06/06 dimensions: mm (inches) bottom view side view pick and place location 3.5 2.5 2.0 3.0 1.5 1.0 0.5 0.0 30 25 40 35 50 45 55 ambient temperature (c) (vin = 12 vdc, vo = 3.3 vdc) output current (a) 65 60 75 70 80 85 nc (0 lfm) tolerances: decimal .x 0.5 (0.02) decimal .xx 0.25 (0.010) output voltage programming via external trim resistor between trim and gnd: rtrim = 10.5 - 1.0 k ? v o - 0.7525 [] via application of external voltage between trim and gnd: vtrim = (0.7 - 0.0667 x {vo - 0.7525}) asia-pacific: tel: +886-2 2562-4117 ? fax: +886-2 2562-4116 europe: tel: +41-41 768 5555 ? fax: +41-41 768 5510 the americas: tel: +1-951 781-5500 ? fax: +1-951 781-5700 www.bourns.com how to order m x 3a - 12 s a (-p) configuration ? m = surface mount device internal identifier output current (amps) input voltage (v) outputs ? s = single output voltage (v) ? a = adjustable optional positive on/off logic fixed output voltage parts and optional features available; contact factory. vin on/off vout trim gnd 20.3 (0.80) 4.83 (0.190) 2.29 (0.090) 1.3 (0.05) 1.5 (0.06) 1.47 (0.058) 8.64 (0.340) 11.43 (0.450) 8.89 (0.350) 4.06 (0.160) 4.57 (0.180) 4.06 (0.160) 1.47 (0.058) 4.32 (0.170) l1 ref. 6.80 (0.268) vin vout gnd trim on/off 0.25 (0.010) 17.53 (0.690) 4.57 (0.180) 1.3 (0.05) 1.5 (0.06) 8.89 (0.350) 8.64 (0.340) 4.06 (0.160) 4.83 (0.190) 4.06 (0.160) recommended pad size: min. x 3.05 (0.120) 2.41 (0.095) max. x 3.43 (0.135) 2.79 (0.110) 9.63 (0.379) 20.32 (0.800) 6.18 (0.243) 11.43 (0.450)
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